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Chip NTC thermistor (NTCR) uses the cover glass glaze structure to achieve the ceramic body andthe electrodes, and glaze porcelain body co-firing.Ends are three layers of Ag/Ni/Sn plating process.Due to the use of external dense protective layer of glass, compared with no glass protection products,in acid and alkali corrosion resistance,moisture resistor and stability and other aspects ut amplio, non potest esse in dura environments.
Chip NTCR non habet ducit, flaking, parva magnitudine, ieiunium responsionem characteres, ad occursum therequires summo densitas SMT, idoneam reflowdering et undam solidatorium solidatus, et solidatam, ut usu
Temperature Deprehensio pro rechargeable altilium, CPU;
Temperature ultricies IC, LCD, Vicus oscillator;